630-629-1800

Capabilities

  • When we think about capabilities, we think about what our customers’ needs are. We want to be able to handle all of our customers’ needs both today and in the future.
  • Mega Circuit is considered one of the most capable PCB fabricators in the industry, from rigid to flex and rigid flex PCBs to Metal Core and heavy copper boards, from basic FR4 PCBs to high tech thermal PCBs using high tech thermal materials, we do it all.
  • In fact, we are one of the few companies in the world that can build long PCBs up to 125 inches. Our goal is to be the most capable PCB fabricator in the industry.

  • Maximum Number of Layers

    up to 36 layers

  • Minimum dielectric thickness

    0.002"

  • Maximum Finished PCB Thickness

    0.50"

  • Maximum Panel Size

    24" x 125"

  • Outer Layers Finished Copper

    maximum 11 oz

  • Inner Layers Finished Copper

    maximum 11 oz

  • Plating in Holes

    up to 10 oz

  • Minimum Outer Line Width

    0.0025"

  • Minimum Inner Line Width

    0.0025"

  • Minimum Space, PCB Edge to Conductor

    0.005"

  • Clearance - Copper to the Center of Score-line

    0.0012"

  • Clearance - Copper to Edge of Board

    0.005"

  • Minimum component pitch

    0.004"

  • Minimum Mechanical Drill Size

    0.004"

  • Maximum Aspect Ratio

    12:1

  • Hole to Hole Spacing

    0.004"

  • Via Fill (Conductive & Non-conductive)

    Yes

  • Blind/Buried Vias

    Yes

  • Micro Vias/HDI

    Yes

  • Stacked Vias

    Yes

  • Back Drill

    Yes

  • Minimum Router Bit Size

    0.011"

  • Minimum Slot width

    0.011"

  • Spacing for Tab Rout

    0.031"

  • V-Score

    Yes

  • Jump Score

    Yes

  • Countersinks

    Yes

  • Counterbores

    Yes

  • Edge Castellations

    Yes

  • Fabrication Radius

    0.005"

  • Layer-to-Layer Registration

    ± 0.003"

  • Dimensions-Fab O.D.

    ± 0.005"

  • Plated Hole

    ± 0.002"

  • Non Plated Hole

    ± 0.001"

  • Fabrication/Rout

    ± 0.003"

  • Solder Mask Clearance Line Coverage

    0.0025"

  • Minimum Solder Mask Dam

    0.0035"

  • Tented Vias

    Yes

  • Mask Plugged Vias

    Yes

  • Peelable Solder Mask

    Yes

  • Low Friction Solder Mask

    Yes

  • LED Ultra White Solder Mask

    Yes

  • Minimum Legend Width

    0.005"

  • Space between Silkscreen & Pad

    0.003"

  • TIN-LEAD HASL

    Yes

  • Lead Free HASL

    Yes

  • Immersion Silver

    Yes

  • Organic Coverage (OSP)

    Yes

  • Immersion Ni/Au Thickness

    Ni 40-800 µinches Au 1-5 µinches

  • Hard Gold/Wire Bondable Soft Gold

    Yes

  • ENEPIG

    Yes

  • Immersion Tin

    Yes

  • Gold Tabs

    Yes

  • Impedance Tolerance

    ± 5%

  • TDR Testing

    Yes