Conductive & Nonconductive Via fill for all laminates > 0.01” thick.
Final finishes include ENIG, ENEPIG, Immersion Silver, Wire Bondable Gold, Hard & Soft Gold, Selective Gold Plating, HASL, Lead Free HASL, Immersion Tin, OSP and selective combinations
Blind & Buried Vias
Edge Plating & Castellations
Cavities and Recessed Launch Sites
Hybrid multilayer constructions
Heavy copper up to 11 OZ
0.00025” etch tolerance
+/- 5% controlled impedance
- Laminate thickness from 0.002” thin to 0.5” thick dielectric.
- Advanced Direct Imaging Machines for micro features and critical registration requirements.
- Mixed dielectrics and hybrid constructions in Multilayer configurations (3-22 layers).
- Hi speed Drilling & Routing with optics for optimized X,Y,Z Back Drilling, Controlled Depth Drilling, tight registration and tight tolerance control.
- Largest inventory of RF materials in North America from all domestic and international suppliers.
- Advanced tolerance Controlled Depth Routing with on-line depth measurements.
- Metal back PCBs.