DWG/DXF to Gerber conversions
Optimizing panel and array layoutfor maximum material utilization making product cost effective.
Impedance modeling, design verification, and testing.
Compliance and Certification reports to:Customer specifications; IPC, AS9100, PPAP, FAI and CMM for dimensional tolerances and true hole positions.
IPC netlist comparison and verification with cad files.
Quality conformance: Coupons and Cross Section analysis complying to IPC standards and custom specifications.
Alternate material suggestion and recommendation for optimum design, performance, cost,and quality.
Characterization of RF/Microwavematerials formechanical and electrical attributes (i.e., Expansion, contraction, Dk, PIM) with different process flow and parameters (i.e., Etching, post mask baking, lamination, drilling, routing,type of final finish, etc.).