Blind and buried vias
0.002” to 0.500” thick dielectrics
Copper from ¼ oz to 11 oz
0.002” line and space
Aspect ratio 12:1
0.00025” mil etch tolerance
Impedance control to +/-5%
Available surface finishes HASL, Lead Free HASL, ENIG, ENEPIG, Immersion Tin, Immersion Silver, OSP.
Differential copper plate up to 8 oz in the holes, and up to 11 oz on the surface
Vias: micro, blind, buried, stacked, cap plated
Filled vias: copper filled, conductive epoxy, non-conductive epoxy, solder mask
Back drilled vias with tightest X,Y,Z tolerances
Long format PCBs up to 125” long
Edge plate and castellation
USA based PCB stocking and Kanban designed for your needs.
Any and all material sets available worldwide.
Launch Pad Cavity
Hybrid, Mixed dielectrics
Low loss materials