You are here : Home  Technology
 
Technology
Capabilities
 
TECHNOLOGY
Unclad, Single, Double and Multilayer (up to 16 Layers)
Materials
    FR4, FR406, FR408, PTFE (Teflon), BT, Cyanate Ester, Polyimide, Multifunctional Epoxy, Ceramic Filled, GETEK®, Low Dk, Low Df, High Tg and Metal Backed
Mixed Dielectric Multilayer Constructions
Blind/Buried Vias
Controlled Impedance/Dielectrics
RoHS Compliant Process Finishes
    Lead-free HAL, Immersion Silver, Electrolytic Soft/Hard Gold, Electroless Nickel/Immersion Gold (ENIG), Immersion Tin and OSP
Sequential Lamination
Silver/Ceramic/LPI Soldermask Filled Vias
Heavy Copper Inner and Outer Layers (up to 10 oz)
Castellation Holes (“half-moon” PTHs)
Controlled Depth Drilling
Heat Sink Fab/Bonding
Edge/Cavity Plating
Carbon Ink/Peelable Soldermask
   
 
ENVIRONMENTALLY CONSCIOUS | YOUR SCHEDULE IS OUR LEAD TIME | PROUDLY MADE IN THE USA
Copyright © 2008 MEGA CIRCUIT, INC All rights reserved
Website Designed By CorpMedia Inc.