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Milestones
 
MILESTONES
• 1985 Began operations in an 8,000 sq. ft. facility
• 1988 Offered first RF, Microwave product
• 1990 Expanded product offerings to include Multilayer PCBs
• 1991 Facility expansion to 14,000 sq. ft.
• 1992 Started RF, Microwave, and Advanced Technologies Division.
• 1994 Facility expansion to 23,000 sq. ft.
• 1996 Introduced Blind/Buried Via Technology
• 1997 Facility expansion to 35,000 sq. ft.
• 2000 Added environmentally friendly Plasma etch back process system
• 2001 ISO 9002/1994 Certification
• 2003 ISO 9001/2000 Certification
• 2004 Added environmentally friendly automatic electroplating PAL system
• 2007 Set Company Sales Record
 
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